RubikLead-Based BGA Rework Solder Paste 50g with Tin-Lead Alloy for Mobile Phone Repair, Chip Planting, and Electronic Component Soldering

Name: RubikLead-Based BGA Rework Solder Paste 50g with Tin-Lead Alloy for Mobile Phone Repair, Chip Planting, and Electronic Component Soldering
Price: 46.00 AUD
Availability: InStock

Product ID: 554205593

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RubikLead-Based BGA Rework Solder Paste 50g with Tin-Lead Alloy for Mobile Phone Repair, Chip Planting, and Electronic Component Soldering

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Fantastic and great service. Shipping was faster than expected.

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